LV600G
LV600G
LV600G
Optimal Vertical Grinding Machining for Semiconductor Material
⦁ Adoption of one-piece high-rigidity bed structure ⦁ Application of box guideways to all axes ⦁ Grinding spindle optimized for semiconductor material processing ⦁ Structure to prevent dust ingress and coolant leakage
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Specifications
| MODEL | LV600G | |
|---|---|---|
| Chuck Size | inch | 12 |
| Max. Machining Diameter | mm | 600 |
| Max. Machining Length | mm | 500 |
| Travel (X/Z) | mm | 790/550 |
| Rapid Feed (X/Z) | mm | 20/24 |
| Spindle Speed | r/min | 500 [2,500] |
| Spindle Power | kW | 15/11 |
| Spindle Torque | N.m | 205.8/68.6 |
| Spindle Drive Type | - | 벨트 |
| No. of Tools | EA | 6 [8] |
| Rotary Tool Speed | r/min | 6,000 [10,000] |
| Slide Type | - | BOX |
These machine specifications are subject to change without notice for quality improvement.
[ ] : Option